JLC say one component, a tiny LED (1x1 m with 4 pads) has to be soldered within 24 hours of opening package, and if not (which JLC say they cannot guarantee) they have to be baked first, as susceptible to moisture.
I assumed it was the pads and would lead to a dry joint.
JLC are saying it’s not, and some aspect of the component itself! Surely that makes no sense as reflow would bake it anyway and moisture is a risk after soldering, if so.
